Fused Deposition Modeling‐Based 3D‐Printed Electrical Interconnects and Circuits

Electrical interconnects revitalized

Models of electrical interconnects, including inductance and skin effect, are reviewed. The models are used for estimating the performance of electrical interconnects, particularly related to delays, data rates, and power consumption for off-chip and on-chip interconnects and for clock distribution. It is demonstrated that correctly utilized, electrical interconnects do not severely limit chip ...

Interconnects and Packaging of Millimeter Wave Circuits

This contribution presents a number of aspects relevant for interconnects and packaging of monolithic integrated circuits, possibly combined with hybrid or even waveguide circuits in the millimeter-wave range. Examples of different interconnects and two realized front-ends are demonstrated.

Curved Layer Fused Deposition Modeling

Current Fused Deposition Modeling (FDM) technologies deposit material as flat layers. The result is a “stair-case” effect on non-vertical or horizontal surfaces, and compromised part strength because of weakness between the laminations. This paper describes a FDM method through which layers of build material are deposited as curved layers following the shape of the part, thus removing the stair...

Self-Organized Three-Dimensional Optical Circuits and Molecular Layer Deposition for Optical Interconnects, Solar Cells, and Cancer Therapy

Modeling and Simulation of High Speed Digital Circuits and Interconnects

Careful design, modeling and simulation of modern high speed circuits is a vital issue in today’s electronic industry. High speed data transfer, and high processing power are accomplished if the circuit of the high speed net was modeled and designed properly. We present the main modeling techniques for both high speed circuits and interconnects used in industry nowadays. A modeling example of a...